Dynatex International
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With over five decades of experience, Dynatex offers a strong base of technical accomplishments and business expertise to assist you with your specific product requirements. Dynatex provides a complete line of die singulation products for dry process dicing, wafer bonding and saw dicing systems. These products are productivity enhancement tools for dicing silicon, gallium arsenide, thin film heads, flat panel displays, solid state lasers and other materials or products.
10/20/2016
WaferGrip Adhesives are designed to bond wafers, thin film heads, optics, and other substrates during dicing, grinding, lapping, and polishing. Designed to minimize air voids and minimize thickness variation, WaferGrip is a more accurate, consistent alternative to wax adhesives.
Learn how WaferGrip can improve your bonding process:
http://www.dynatex.com/wafergrip-adhesives_8_113_26194.html
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Santa Rosa, CA
95403
Opening Hours
| Monday | 9am - 5pm |
| Tuesday | 9am - 5pm |
| Wednesday | 9am - 5pm |
| Thursday | 9am - 5pm |
| Friday | 9am - 5pm |
