Rogue Valley Microdevices

Rogue Valley Microdevices is headquartered in southern Oregon—a charming location that is known for its spectacular natural settings, renowned Shakespeare Festival, world-class vineyards, and eclectic dining. Our company is growing—and we want you to join our team.

Since 2003, we’ve helped innovators realize new technologies that transform smart products in automotive, agriculture, biomedical, and industrial. Now you can play a pivotal role in bringing these products to market.

We offer competitive benefits, including medical, dental, 401(k), and relocation packages. Send resumes to [email protected].

Take the first step on your journey with us. Tell us about your application and target audience. Define the goals for production. The more clarity we have as we begin our engagement, the more seamless the development process will be.

While most foundries won’t touch precious metals, we consider them a normal part of processing.

When your process requires precious metals deposition, E-beam evaporation provides an excellent choice for wafers that require lift-off processing. We’re experts at keeping the underlying wafer and photoresist cool during metal deposition, delivering the best possible results.

Our E-beam evaporation process provides excellent film-thickness control and can deposit up to six different materials in-situ. While it’s almost impossible for most other foundries to achieve this level of control while depositing thick layers, we’ve developed a specialized time-tested low-temperature E-Beam evaporation process, specifically for use during metal lift-off processing. We offer E-Beam films on substrate diameters 100mm, 150mm, 200mm.

MEMS, biomedical devices, and optical devices often require smaller geometries and tighter line widths than a contact aligner can achieve. That’s why we maintain both I-line stepper lithography equipment and contact lithography equipment with front-to-back alignment capability. Our front-to-back contact aligner provides patterning alignment on both the back and front sides of the substrate for your MEMS and biomedical devices.

Refine the process! We make your device easier to produce and increase yield before moving to production mode.

PECVD SiON is a mechanically stable film with optical properties that make it ideal for integrated circuits. It features a refractive index or film stress in a made-to-order recipe that meets your process requirements. Film thickness up to 4µm on on substrate diameters: 50.8mm, 76.2mm, 100mm, 125mm, 150mm, 200mm, 300mm.

- Targeted Refractive Index SiON
- Targeted Film Stress SiON
- Low Temp SiON