ESSCIRC - ESSDERC 2022

ESSCIRC-ESSDERC 2022 | PAPER SUBMISSION DEADLINE EXTENDED!

📆 NEW Submission deadline: Apr 19, 2022 23:59 (GMT -0700)
Decision notification: May 31, 2022 23:59 (GMT -0700)

▶ Papers submitted for review must clearly state:
◾The purpose of the work
◾How and to what extent it advances the state-of-the art
◾Specific results and their impact

▶ Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference.

▶ After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 31 May 2022.

More info:
https://www.esscirc-essderc2022.org/call-for-papers

ESSDERC ESSCIRC 2022 | Final Call for Papers

▶Paper submission is open! Papers submission deadline: April 12, 2022. Manuscript guidelines as well as instructions on how to submit electronically are available on the conference website.

💡 Conference Tracks:
◾ Advanced Technology, Process and Materials
◾ Analog, Power and RF Devices
◾ Compact modeling and process/device simulation
◾ Analog
◾ Data Converters
◾ RF & mm-Wave
◾ Frequency Generation Circuits
◾ Digital Circuits & Systems
◾ Power Management
◾ Wireless & Wireline Circuits & Systems
◾ Emerging Computing Devices and Circuits
◾ Memory Devices & Circuits Towards Non-von Neumann
◾ Devices & Circuits for Sensors, Optoelectronics & Display

More info:
https://www.esscirc-essderc2022.org/call-for-papers

ESSDERC - ESSCIRC 2022 Workshops (3/3)

We have organized 9 Workshops for ESSDERC/ESSCIRC 2022 in Milan, September, 19, 2022 to gather experts to discuss about the next challenges and future perspectives high-technology fast evolving fields.

Here are the abstracts for three of them (this is the 3rd message of 3)

▶ Wearable Applications and Artificial Intelligence Based on 2D materials
(Chairs: G. Fiori, G. Iannaccone, Univ. Pisa, IT)

▶ Computing Architecture for AI
(Chair: B. McColl, Huawei Research, CH)

▶ Future of Short Reach Interconnect
(Chair: D. Tonietto, Huawei Technologies, CA)

More info at https://www.esscirc-essderc2022.org/

ESSDERC - ESSCIRC 2022 Workshops (2/3)

We have organized 9 Workshops for ESSDERC/ESSCIRC 2022 in Milan, September, 19, 2022 to gather experts to discuss about the next challenges and future perspectives high-technology fast evolving fields.

Here are the abstracts for three of them (this is the 2nd message of 3)

▶ BEOL compatible ferroelectric device technologies for neuromorphic computing
(Chairs: D. Esseni, Univ. Udine, IT, S. Slesazeck, NaMLab, DE)

▶ Bosch - ASIC Development for MEMS Sensors - Challenges and Solution Approaches
(Chair: D. Droste, Bosch Sensortec, DE)

▶ A year of Open Source MPWs: Review, Takeaways and Roadmap
(Chair: Dennis Sylvester, Univ. Michigan, US)

More info at www.esscirc-essderc2022.org

ESSDERC - ESSCIRC 2022 Workshops (1/3)

We have organized 9 Workshops for ESSDERC/ESSCIRC 2022 in Milan, September, 19, 2022 to gather experts to discuss about the next challenges and future perspectives high-technology fast evolving fields.

Here are the abstracts for three of them (this is the 1st message, other two ones will follow)

▶ Wide bandgap semiconductors for energy efficiency and RF communications (Chair M. Meneghini, Univ. of Padova, IT)

▶ Gallium Nitride in Power Electronics converters. Motor drive, dc-dc, and Lidar (Chair: M. Palma, Efficient Power Conversion, IT)

▶ Wafer-level 3D Stacked Imagers: Technologies and Sensors Architectures (Chair: D. Stoppa, Sony Semiconductor Solutions - Sony Europe B.V.)

More info at www.esscirc-essderc2022.org