CSMH

👏 👏 Fourth band semiconductor materials in the spotlight again

CEO, XING ZHANG, gave a speech on the topic of Ultra High Thermal Conductivity Diamond - A New Generation of Advanced Packaging Materials at the Chip China Conference.

As the demand of chip arithmetic power continues to increase, chip power consumption and power density continue to rise, and heat becomes a limitation to chip development.

High heat can lead to a rapid increase in chip temperature, which in turn affects its performance and reliability. It has become critical to effectively transfer heat away from inside the chip. For example, the heat between the chip and the chip, and the heat between the chip and the package enclosure.

's ultra-high thermal conductivity brings new solutions.

We are pleased to find that the integration of diamonds into UAV solar cells, chips, sensors, and diamond gyroscopes will enhance the radar sensing capabilities, sensitivity, endurance, and power efficiency of UAVs. CSMH's primary products consist of diamond heat sinks, wafers, windows, and heterojunction integrated composite substrates.